The products CLD-DBD0E are directly modulated 2.5Gbps 1270nm edge-emitting DFB laser diode chips which are used in XGPON with operating temperature range from -20°C up to 85°C. The design is a Ridge Waveguide on n-type substrate with multi-quantum well (MQW) active layers and gratings. These products utilize sophisticated cleaved facet technology and mirror coating processes, and regular codes printed on the top surface of each chip for identification purpose. All the laser chips come from the certified wafers which must achieve an acceptable yield for burn-in, aging tests, and each shipped laser chip is fully screened.